Thermal characteristic evaluation system to evaluate heat transfer characteristics of mounted materials

he increasing amount of heat generated by electronic devices is making devices thermal design and ways to combat heat more and more important issues to deal with. Therefore, we have developed a system able to evaluate thermally conductive materials such as conductive adhesives. The measurement technology is based on the steady-state method, and can evaluate heat transfer characteristics of mounted materials. In other words, it enables measurements of values not supported by conventional bulk thermal conductivity measurements effective thermal conductivity and thermal resistance values that include the thermal resistance of the interface between the conductive adhesive and adhered material. This report provides an overview of the equipment we developed, and describes an example of its application.